INEX Thermal Conductive Phase Change Sheet HT-21
Product details
| Management number | 237043367 | Release Date | 2026/07/10 | List Price | US$7.40 | Model Number | 237043367 | ||
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| Category | |||||||||
■ Use between CPU or chip and heatsink. - Softens with heat and improves adhesion for heat dissipation performance. ■ High thermal conductivity of 7.5 W/m/ K. ■Softening between 50 degrees C to 70 degrees C, the initial pad thickness will be reduced to a thin bond line of about 35 μm. ■ Excellent wet contact surface and replacement of air, with excellent low heat resistance. ■ 2,000 hours of various aging test shows reliability at an operating temperature of 150 degrees Celsius. ■ Special polymer matrix provides superior pump-out resistance compared to thermal grease and other phase change materials. ■ Non-silicone formula provides moderate adhesion.
- Laird Technologies, Inc. Tpcm 7125
- Thermal conductivity: 7.5W/m·K
- Heat Resistance: 0.10°C, cm2/W (at 10psi/70°C), 0.06°C, cm2/W (at 50psi/70°C), Working Temperature: -40~125°C, Softening Temperature: 50~70°C
- Bond Line Thickness (BLT): 35μm, Dielectric Rate: 31.54 (1MHz), Volume Resistance Rate: 5.4 x 1015 Ω, Flame Retardant: UL94 V-0
- Color: Gray; Size: W1.4 x D1.4 x H0.05 inches (W35 x D35
| ASIN | B0DJVMTQSH |
|---|---|
| Brand | AINEX |
| Item Weight | 0.035 ounces |
| Manufacturer | AINEX |
| Item model number | HT-21 |
| Product Dimensions | 1.38 x 1.38 x 0.01 inches |
| Item Dimensions LxWxH | 1.38 x 1.38 x 0.01 inches |
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